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Latest Offering

Wafer Bumping Services (click for more info)

Latest News

  • Unisem Places Order With BE Semiconductor Industries N.V. For 154 ESEC Wire Bonders
  • Unisem Reports Third Quarter 2009 Results
  • Unisem Sunnyvale Adds LTX-Credence's MX Platform as its Test Solution for the Fast Growing RF Market
  • Unisem Receives Supplier of the Year Award from TriQuint
  • Unisem and ASAT Limited Enter Into Cross Licensing Agreement
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