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Batam
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Wafer Bumping Services
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Latest News
Unisem Receives Exceptional Service Award from Semtech
Unisem Advanced Technologies Tripling Wafer Bumping Capacity
Unisem Receives FY2010 Supplier of the Year Award from Exar
Unisem Introduces New High Density Leadframe Based Packaging
Unisem 2009 Annual Report
