Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. With approximately 7,000 employees worldwide, Unisem has factory locations in Ipoh, Malaysia; Chengdu, People’s Republic of China; Batam, Indonesia, and Sunnyvale, USA. The company is headquartered in Kuala Lumpur, Malaysia.
Watch video interview with our Group COO, Mr. Lee Hoong Leong from Stocks Around Us (Oct 24, 2014).