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Latest Offering

Wafer Bumping Services (click for more info)

Latest News

  • Quarterly Results for period ended 30 September 2008
  • Unisem Begins Volume Production of Packages Using Proprietary Copper Wirebonding Process
  • Unisem Chooses North American Region Head Mike Griffin to Lead Worldwide Business Development Efforts
  • Unisem Europe Receives Recognition Award from Ember
  • Unisem and FlipChip International Sign Licensing Agreement
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