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ELP Package Offerings
Additional ELP Information
ELP Advantages
Higher stand-off
I / O multiplicity
Power & Ground ring
Better thermal X-fer & rigidity at WB
Isolated die pad
Zero mold flash
Isolated units after back -etching
Requires backside-etching process
No metal sawing
Strip testing capable
Eliminates laser residue cleaning
Basic ELP Process Flow
Leadframe: half etched, top and bottom selective plating
Die attach
Wire bonding
Mold
Etching (back-patterning) and resist stripping
Plating: Electroless / Immersion Sn
Single pass Singulation: No metal cutting
Compatible with strip-testing
ELP Variations
Wire bonded
Flip-Chip
Array (ELGA)
Stacked Die
System-in-package
Footprint and Cost Reduction
Comparison vs. QFN 10x10, 72L, 0.5mm pitch
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