• Unisem reports results for the third quarter ended 30 September 2011, 01 November 2011
• Unisem Europe Adds Verigy's V93000 Test Platform , 06 September 2011
• Unisem Chooses LTX-Credence's PAx RF Test System for Front End RF Devices, 1 August 2011
• Unisem reports results for the second quarter ended 30 June 2011 , 28 July 2011
• Unisem Announces Selection of Teradyne J750Ex for Consumer Digital Testing , 11 July 2011
• Unisem reports results for the first quarter ended 31 March 2011 , 27 April 2011
• Unisem to Exhibit at GSA Conference in Munich, Germany, 26 April 2011
• Unisem Sunnyvale Continues to Expand Capabilities with New Twelve Inch Accretech Wafer Prober , 14 March 2011
• Unisem Reports Fourth Quarter 2011 Results, 24 February 2011

• Unisem Reports Third Quarter 2010 Results, 2 November 2010
• Unisem Reports Second Quarter 2010 Results, 30 July 2010
• Unisem Advanced Technologies Tripling Wafer Bumping Capacity, 12 July 2010
• Unisem Introduces New High Density Leadframe Based Packaging , 7 June 2010
• Unisem Reports First Quarter 2010 Results, 5 May 2010
• Unisem Receives Three Best Supplier Awards from AATI, 14 April 2010
• Unisem Reports Fourth Quarter 2009 Results, 22 February 2010
• Unisem Advanced Technologies Develops Stress Buffer to Protect Semiconductor Device Features, 25 January 2010

• Unisem Places Order With BE Semiconductor Industries N.V. For 154 ESEC Wire Bonders, 16 November 2009
• Unisem Reports Third Quarter 2009 Results, 2 November 2009
• Unisem Sunnyvale Adds LTX-Credence's MX Platform as its Test Solution for the Fast Growing RF Market, 21 August 2009
• Unisem Reports Second Quarter 2009 Results, 29 July 2009
• Unisem and ASAT Limited Enter Into Cross Licensing Agreement, 20 July 2009
• SRM's XD248 Brings High Speed QFN Handling to Unisem Sunnyvale , 22 June 2009
• Unisem Sunnyvale Adds Teradyne's Eagle 364 Test Platform , 1 June 2009
• Unisem Wales Launches New Business Model, 2 March 2009
• Salem Belmeguenai appointed COO - Senior Vice President of Unisem Batam, 19 February 2009
• Quarterly results for the period ended 30 September 2008 , 6 November 2008
• Unisem Begins Volume Production of Packages Using Proprietary Copper Wirebonding Process, 13 October 2008
• Unisem Chooses North American Region Head Mike Griffin to Lead Worldwide Business Development Efforts, 9 October 2008
• Quarterly results for the period ended 30 June 2008 , 28 July 2008
• Unisem and FlipChip International Sign Licensing Agreement , 16 June 2008
• Unisem Group CEO Resigns, 5 June 2008
• Chengdu Factory Update, 16 May 2008
• Chengdu Factory Update, 13 May 2008
• Quarterly results for the period ended 31 March 2008, 8 May 2008
• Unisem receives Supplier of the Year Award from Exar Corporation, 25 March 2008
• Quarterly results for the period ended 31 December 2007, 20 February 2008
• Unisem and KVD Announce Strategic Partnership, 4 February 2008
• Quarterly results for the period ended 30 September 2007, 1 November 2007
• Unisem received Supplier of the Year 2006 Award from Sirenza Microdevices, Inc., 7 August 2007
• Corporate Presentation - Post AIT Transaction, 3 August 2007
• Unisem appoints Bruno Guilmart as Group CEO and CH Ang as Group COO, 2 August 2007
• Quarterly results for the period ended 30 June 2007, 2 August 2007
• Unisem completes acquisition of AIT, 18 July 2007
• Advanced Interconnect Technologies signs assembly service agreement with Elmos Semicondutor for automotive ICs, 25 June 2007
• Quarterly results for the period ended 31 March 2007, 15 May 2007
• Advanced Interconnect Technologies receives JEDEC approval for its etched leadless package, 14 May 2007
• Unisem (M) Berhad ("Unisem") received Supplier Recognition Award from TriQuint Semiconductor, Inc. (Texas), 16 March 2007
• Unisem (M) Berhad today announced results for the fourth quarter ended 31 December 2006 (4Q06), 27 February 2007
• Unisem received Supplier of the Year Award from Power Integrations, Inc., 28 February 2007
• Unisem (M) Berhad received Best Performance Award from Zetex Semiconductors plc., 14 February 2007
• Unisem Europe received Excellence Service and Support Award from Innova Card, 14 February 2007
• Unisem (M) Berhad ("Unisem") redeemed all of its US$100,000,000 2.0% Guaranteed Convertible Bonds Due 2009 (the "2% US$100 million CB") issued by Unisem International (Labuan) Limited and unconditionally and irrevocably guaranteed by Unisem, 13 February 2007
• Advanced Interconnect Technologies announces that AMI Semiconductor is now in volume production with stacked die QFN package, 29 January 2007
• Unisem (M) Berhad certified with ISO/TS 16949:2002, 11 January 2007
• Unisem Chengdu Co., Ltd. And Hong Kong Science & Technology Parks Corporation Enter Into Memorandum Of Understanding To Promote Hong Kong As A Semiconductor Development Centre, 14 November 2006
• Quarterly results for the third quarter ended 30 September 2006, 6 November 2006
• Unisem Chengdu opens its phase one factory in Chengdu, Sichuan, PRC, 26 October 2006
• Unisem Obtained Syndicated Financing Facilities of RM400 Million from 6 Malaysian Banks, 27 September 2006
• Banking Facilities - Unisem Chengdu Co., Ltd., 22 August 2006
• Quarterly results for the second quarter ended 30 June 2006, 3 August 2006
• Unisem received Excellence World Class Service and Support Award from Micrel, 18 May 2006
• Quarterly results for the first quarter ended 31 March 2006, 8 May 2006
• Quarterly results for the fourth quarter ended 31 December 2005, 27 February 2006
• Unisem raised RM120 million through Syndicated Islamic Corporate Financing Facility, 24 November 2005
• Unisem unveils new corporate logo, 18 November 2005
• Appointment of senior vice presidents, 16 November 2005
• Quarterly results for the third quarter ended 30 September 2005, 21 October 2005
• Unisem raised US$50 million through an issue of convertible bonds, 4 February 2005
• Unisem and Advanpack Solutions Pte Ltd, Singapore entered into a joint-venture agreement for latest wafer bumping and flip chip technology, 22 September 2004
• Unisem setting up a semiconductor manufacturing facility in Chengdu Export and Processing West Zone, Sichuan, China, 13 August 2004
• Completion of the acquisition of Atlantic Technology Holdings (UK) Limited (now known as Unisem (Europe) Holdings Limited), 6 July 2004
• Unisem raised US$100 million through an issue of convertible Eurobonds, 13 February 2004
• Unisem entered into a conditional sale and purchase agreement to acquire Atlantic Technology Holdings (UK) Limited (now known as Unisem (Europe) Holdings Limited), 3 December 2003

For Unisem (M) Berhad's announcements to the Malaysian stock exchange kindly visit http://announcements.bursamalaysia.com.