Press Releases

2008    |    2007    |    2003-2006

• Quarterly results for the period ended 30 September 2008 , 6 November 2008
• Unisem Begins Volume Production of Packages Using Proprietary Copper Wirebonding Process, 13 October 2008
• Unisem Chooses North American Region Head Mike Griffin to Lead Worldwide Business Development Efforts, 9 October 2008
• Quarterly results for the period ended 30 June 2008 , 28 July 2008
• Unisem and FlipChip International Sign Licensing Agreement , 16 June 2008
• Unisem Group CEO Resigns, 5 June 2008
• Chengdu Factory Update, 16 May 2008
• Chengdu Factory Update, 13 May 2008
• Quarterly results for the period ended 31 March 2008, 8 May 2008
• Unisem receives Supplier of the Year Award from Exar Corporation, 25 March 2008
• Quarterly results for the period ended 31 December 2007, 20 February 2008
• Unisem and KVD Announce Strategic Partnership, 4 February 2008

Press Releases

2008    |    2007    |    2003-2006

• Quarterly results for the period ended 30 September 2007, 1 November 2007
• Unisem received Supplier of the Year 2006 Award from Sirenza Microdevices, Inc., 7 August 2007
• Corporate Presentation - Post AIT Transaction, 3 August 2007
• Unisem appoints Bruno Guilmart as Group CEO and CH Ang as Group COO, 2 August 2007
• Quarterly results for the period ended 30 June 2007, 2 August 2007
• Unisem completes acquisition of AIT, 18 July 2007
• Advanced Interconnect Technologies signs assembly service agreement with Elmos Semicondutor for automotive ICs, 25 June 2007
• Quarterly results for the period ended 31 March 2007, 15 May 2007
• Advanced Interconnect Technologies receives JEDEC approval for its etched leadless package, 14 May 2007
• Unisem (M) Berhad ("Unisem") received Supplier Recognition Award from TriQuint Semiconductor, Inc. (Texas), 16 March 2007
• Unisem (M) Berhad today announced results for the fourth quarter ended 31 December 2006 (4Q06), 27 February 2007
• Unisem received Supplier of the Year Award from Power Integrations, Inc., 28 February 2007
• Unisem (M) Berhad received Best Performance Award from Zetex Semiconductors plc., 14 February 2007
• Unisem Europe received Excellence Service and Support Award from Innova Card, 14 February 2007
• Unisem (M) Berhad ("Unisem") redeemed all of its US$100,000,000 2.0% Guaranteed Convertible Bonds Due 2009 (the "2% US$100 million CB") issued by Unisem International (Labuan) Limited and unconditionally and irrevocably guaranteed by Unisem, 13 February 2007
• Advanced Interconnect Technologies announces that AMI Semiconductor is now in volume production with stacked die QFN package, 29 January 2007
• Unisem (M) Berhad certified with ISO/TS 16949:2002, 11 January 2007

Press Releases

2008    |    2007    |    2003-2006

• Unisem Chengdu Co., Ltd. And Hong Kong Science & Technology Parks Corporation Enter Into Memorandum Of Understanding To Promote Hong Kong As A Semiconductor Development Centre, 14 November 2006
• Quarterly results for the third quarter ended 30 September 2006, 6 November 2006
• Unisem Chengdu opens its phase one factory in Chengdu, Sichuan, PRC, 26 October 2006
• Unisem Obtained Syndicated Financing Facilities of RM400 Million from 6 Malaysian Banks, 27 September 2006
• Banking Facilities - Unisem Chengdu Co., Ltd., 22 August 2006
• Quarterly results for the second quarter ended 30 June 2006, 3 August 2006
• Unisem received Excellence World Class Service and Support Award from Micrel, 18 May 2006
• Quarterly results for the first quarter ended 31 March 2006, 8 May 2006
• Quarterly results for the fourth quarter ended 31 December 2005, 27 February 2006
• Unisem raised RM120 million through Syndicated Islamic Corporate Financing Facility, 24 November 2005
• Unisem unveils new corporate logo, 18 November 2005
• Appointment of senior vice presidents, 16 November 2005
• Quarterly results for the third quarter ended 30 September 2005, 21 October 2005
• Unisem raised US$50 million through an issue of convertible bonds, 4 February 2005
• Unisem and Advanpack Solutions Pte Ltd, Singapore entered into a joint-venture agreement for latest wafer bumping and flip chip technology, 22 September 2004
• Unisem setting up a semiconductor manufacturing facility in Chengdu Export and Processing West Zone, Sichuan, China, 13 August 2004
• Completion of the acquisition of Atlantic Technology Holdings (UK) Limited (now known as Unisem (Europe) Holdings Limited), 6 July 2004
• Unisem raised US$100 million through an issue of convertible Eurobonds, 13 February 2004
• Unisem entered into a conditional sale and purchase agreement to acquire Atlantic Technology Holdings (UK) Limited (now known as Unisem (Europe) Holdings Limited), 3 December 2003

For Unisem (M) Berhad's announcements to the Malaysian stock exchange kindly visit http://announcements.bursamalaysia.com.