Reliability Monitoring

Unisem has fully equipped package reliability qualification & product analysis labs at each site to support our customers' requirements for new package qualification testing, ongoing reliability monitoring and continuous yield improvement.

The quantitative and qualitative assessments of package reliability focus on the identification and timely elimination of processing deficiencies that degrade product performance in a real world application.

Each Unisem site has the capability to perform the standard Package Reliability Qualification and Reliability Audit Program test requirements in accordance with JESD47E standard specifications or specific customer requirements.
 
Click for the list of standard Package Qualification and Reliability Audit Program test matrix.

Reliability Audit Program (RAP)

The reliability monitoring program is performed in each site to assure our on-going improvement in our package reliability. Unisem's standard RAP tests reference JESD47 and Automotive RAP tests reference AEC-Q100.

Package Analysis Labs

The Package Analysis Labs in each of Unisem site are well equipped with state-of-art equipment combined along with our technical expertise to provide a full breadth of package level analysis and capabilities support:

  • New package development and package qualification
  • Material characterization
  • Assembly yield loss analysis and improvement
  • Reliability failure analysis and improvement
  • Test failure analysis and improvement
  • Reliability Audit Program
 
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Package Reliability Qualification and Reliability Audit Program (RAP) Test Matrix

Reliability Test Methods Abbrev. Reference Standards Standard Requirements as per JESD47E4
Moisture Sensitivity
Level Classification
MSL J-STD-020D Sample size per lot SS = 22, acc = 0
Test Conditions Per appropriate MSL
attained by the package
Test Duration
Preconditioning1
Autoclave2
PC-AC JESD22-A102 Sample size per lot SS = 253, acc = 0
Test Conditions 121ºC / 100% RH
Test Duration 0 / 96 Hr
Preconditioning1
Unbiased Highly Accelerated
(Temp/RH) Stress Test2
PC-UHAST JESD22-A118 Sample size per lot SS = 253, acc = 0
Test Conditions 130ºC / 85% RH
Test Duration 0 / 96 Hr
Preconditioning1
Temperature Cycling
PC-TC JESD22-A104 Sample size per lot SS = 253, acc = 0
Test Conditions -65ºC / +150ºC
Test Duration 0 / 500 Cyc
High Temperature Storage Life HTSL JESD22-A103 Sample size per lot SS = 253, acc = 0
Test Conditions 150ºC
Test Duration 0 / 500 / 1000 Hr
Note 1: Preconditioning per appropriate MSL attained by the package
 
Note 2: Unbiased Highly Accelerated Stress Test is a new requirement for leaded and substrate packages.
Autoclave is an alternative to UHAST for metal leadframe based package.
 
Note 3: Decap will be performed pre-PC and upon post PC test completion (AC / UHAST, TC & HTSL)
on additional 3 unit samples each to inspect for any assembly / package abnormalities or
galvanic corrosion sign on die and microcrack on package visual as a result of the stressed testing.
For automotive devices, SS=77, acc=0. Decap wirepull sample size is 5 units.  
Note 4: Any special additional customer requirements shall be handled on a case by case basis
and will result in additional charge.

Reliability Audit Program (RAP)
Reliability monitoring program is performed to assure our on-going improvement in our package reliability.
Unisem’s standard RAP tests shall reference to JESD47 and Automotive RAP tests shall reference to AEC-Q100