Package Offerings

Unisem designs and creates both Array and Leadframe packages for the global IC market. Our turn-key services include Electrical and Thermal Characterization, Design, Assembly, Testing, Failure Analysis and more. And with our real-time WIP systems and drop shipping to OEM's, Unisem offers its customers everything needed for time-to-market wins.

Unisem offers a broad range of standard and custom leadframe and array packages with pin counts ranging from 3 to 700+. Also offered are WLCSPs or Wafer-Level Chip-Scale Packages which is a low cost solution that enables direct connectivity at the substrate or board level.