Unisem - Packages & Services - Package Offerings - Array Packages

Stacked Die BGA

Unisem's SIP (System in Package) technology can be used to place 2 or more die in a single array package resulting in fewer packages and a smaller footprint, thus reducing costs. The "SiP" framework is designed to provide higher levels of integration which decreases the number of needed components and trims the size and routing complexity of the printed circuit board.

Package Configuration

Stacked Die BGA

Close Window

Body Size (mm)	Ball Count	Ball Pitch (mm)
*3.0 X 3.0	9	n/a
*7.0 X 7.0	64	n/a
4.5 X 7.0	52	0.65 mm
5.0 X 5.0	49	0.65 mm
	64	0.50 mm
5.5 X 13.5	96	0.80 mm
5.5 X 16.0	114	0.80 mm
6.0 X 6.0	36	0.80 mm
	64	0.50 mm
7.0 X 7.0	49	0.80 mm
	64/72/121/129	0.50 mm
8.0 X 8.0	64/81	0.80 mm
	121	0.65 mm
	108/145/169/184/196	0.50 mm
9.0 X 9.0	80	0.80 mm
9.9 X 9.9	140	0.80 mm
9.0 X 13.0	160	0.65 mm
10.0 X 10.0	100/144	0.80 mm
11.0 X 11.0	100	1.00 mm
	169	0.80 mm
13.0 X 13.0	144	1.00 mm
	169/176	0.80 mm
	288	0.65 mm
15.0 X 15.0	196	1.00 mm
	208/236/239/289	0.80 mm
	256	0.65 mm
17.0 X 17.0	256	1.00 mm
	256/280/361	0.80 mm
19.0 X 19.0	324	1.00 mm
23.0 X 17.0	261	1.00 mm
23.0 X 23.0	324/376	1.00 mm

* LGMA