Unisem - Packages & Services - Package Offerings - Array Packages

FBGA / LGA

Our Fine-pitch Ball Grid Array (FBGA) is a chip-scale package designed especially for markets requiring miniaturization, such as hand-held consumer products, cellular phones and laptop computers. The FBGA features a standard BT substrate and fine solder ball pitch, available in 0.5mm and 0.8mm sizes. It also offers the fastest assembly throughput of our fine-pitch packages. This package is also available in an LGA (land grid array) version for an ultra thin profile.

Package Configuration

FBGA / LGA

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Body Size (mm)	Ball Count
2.3 X 6.9	5
3.0 X 3.0	9,12
4.0 X 4.0	10,24
4.0 X 4.5	28
4.5 X 4.5	64
4.5 X 5.0	16
4.5 x 7	52
5.0 X 5.0	27,40,49,56,65
5.0 X 7.0	36
5.0 X 11.5	96
5.0 X 16.0	176
5.5 X 13.5	96
5.5 X 16.0	54,114
6.0 X 6.0	6,20,24,48,64,86,100,101,121
6.0 X 7.0	48
6.0 X 8.0	48
6.0 X 9.0	186
7.0 X 7.0	48,49,64,72,96,100,121,128,129,144,169
7.5 X 4.0	52
7.5 X 4.25	54
7.0 X 8.0	23,24
8.0 X 8.0	64,81,121,132,145,169,184,196
8.0 X 9.5	48
8.0 X 13.0	150
8.0 X 20.0	60
9.0 X 9.0	81,100
9.0 X 13.0	160
9.9 X 9.9	140
10.0 X 10.0	73,100,128,144,281
11.0 X 11.0	100,168
12.0 X 12.0	169,179,196
13.0 X 13.0	32,144,169,225
13.0 X 15.0	165
14.0 X 14.0	208,289
14.0 X 22.0	209
15.0 X 10.0	338
15.0 X 15.0	172,196,208,239,256,265,289
15.0 X 17.0	165
17.0 X 17.0	256,280,361,400
19.0 X 19.0	300,324,448,484,529
21.0 X 21.0	300
23.0 X 17.0	261
23.0 X 23.0	352,376,641