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FBGA / LGA

Our Fine-pitch Ball Grid Array (FBGA) is a chip-scale package designed especially for markets requiring miniaturization, such as hand-held consumer products, cellular phones and laptop computers. The FBGA features a standard BT substrate and fine solder ball pitch, available in 0.5mm and 0.8mm sizes. It also offers the fastest assembly throughput of our fine-pitch packages. This package is also available in an LGA (land grid array) version for an ultra thin profile.

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Array Packages

FBGA / LGA

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Body Size (mm)	Ball Count	Ball Pitch (mm)
*3.0 X 3.0	9	n/a
*7.0 X 7.0	64	n/a
4.5 X 7.0	52	0.65 mm
5.0 X 5.0	49	0.65 mm
	64	0.50 mm
5.5 X 13.5	96	0.80 mm
5.5 X 16.0	114	0.80 mm
6.0 X 6.0	36	0.80 mm
	64	0.50 mm
7.0 X 7.0	49	0.80 mm
	64/72/121/129	0.50 mm
8.0 X 8.0	64/81	0.80 mm
	121	0.65 mm
	108/145/169/184/196	0.50 mm
9.0 X 9.0	80	0.80 mm
9.9 X 9.9	140	0.80 mm
9.0 X 13.0	160	0.65 mm
10.0 X 10.0	100/144	0.80 mm
11.0 X 11.0	100	1.00 mm
	169	0.80 mm
13.0 X 13.0	144	1.00 mm
	169/176	0.80 mm
	288	0.65 mm
15.0 X 15.0	196	1.00 mm
	208/236/239/289	0.80 mm
	256	0.65 mm
17.0 X 17.0	256	1.00 mm
	256/280/361	0.80 mm
19.0 X 19.0	324	1.00 mm
23.0 X 17.0	261	1.00 mm
23.0 X 23.0	324/376	1.00 mm

* LGMA