Our Plastic Ball Grid Array (PBGA) is well suited to the low-cost consumer product, PC and wireless telecommunication markets that require surface-mount board assembly. An industry standard BGA package, the PBGA also serves as a low-cost alternative to fine-pitch leaded packages. It's available in 208 to 761 ball counts, in body sizes ranging from 17mm to 40mm square.
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PBGA
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Available Options: Stacked die, Multi Die
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