SBGA Super BGA

The SuperBGA® (SBGA) technology provides a very low profile, high-power BGA package available in a broad line of ball (I/O) counts and standard JEDEC body sizes. This technology is used for high-speed, high-power semiconductors, such as ASICs, Micro processors, Gate Arrays and DSPs requiring high-performance packages.
 
Package Configuration

SBGA
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Ball Count Body Size (mm)
288 23x23
320 25x25
420 27x27
272 29x29
304,500 31x31
372 35x35