Package Offerings • Assembly • Test • Wafer Bumping • Design / Characterization

Array Packages • Leadframe Packages • Leadless Packages • Wafer Level Packaging • MEMs

Micro-P Micro Plastic Package

A small 4 lead plastic package used for RF Transistor and Amplifier applications.

Package Configuration

Leadframe Packages

Micro-P

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Lead Count	Dim. (In.)
4	0.085

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