Package Offerings • Assembly • Test • Wafer Bumping • Design / Characterization

Array Packages • Leadframe Packages • Leadless Packages • Wafer Level Packaging • MEMs

TO220/TO263 Transistor Outline package

TO packages are available in both straight and formed lead options as and offer high electrical and thermal performance for power applications.

Package Configuration

Leadframe Packages

TO220/263

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Lead Count	Dim. (mil)
3.5	400

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