TSSOP

The TSSOP has a tighter lead pitch is thinner (at 0.9 mm) than the standard SOP. These IC packages are particularly suited for gate drivers, controllers, wireless / RF, op amps, logic, analog, ASICs, memory (EPROM, E²PROM), comparators and optoelectronics.
 
Package Configuration

TSSOP
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Lead Count Dim. (mm)
8,14,16,20,24,28,38 4.4
48,56,64 6.1
Available Options: EPAD