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ELP

Unisem's Etched Leadless Packages (ELP) delivers design flexibility, increased density and a reduced footprint. Based upon our patented technology, the advanced ELP framework leverages our world-class selective Etching process, allowing tight integration of multiple I/Os into a reduce area. The ELP has also received approval from JEDEC (MO 247) as a standard in multi-row leadframe packaging.
 
Package Configuration

Leadless Packages

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ELP
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Lead Count Body Size (mm)
8 2x2
8,12,16,20 3x3
12,16,20,24,28 4x4
20,24,28,32,36,40 5x5
24,28,32,36,38,40,48,52,68,84 6x6
32,36,40,44,48,56,68,92,116,128,156 7x7
36,40,44,48,52,56,64,76,104,108,152,180 8x8
44,48,56,60,64,72,92,124,128,156,176,216 9x9
52,64,68,72,88,100,140,172,200,240 10x10
64,80,100,124,172,176,212,248,300 11x11
64,80,100,124,172,176,212,248,300 12x12
100,108,132,140,188,200,236,272,336 13x13
Available Options: Stacked die, System in Package,
Flip Chip, Chip on Lead, Multi Die