Unisem's Leadframe Grid Array (LFGA) package (based on QPL's patented technology) offers the flexibility of an array package without the high substrate cost. The LFGA is a leadframe based package that can be configured in a fully populated grid array providing a significantly reduced footprint. The reduced footprint also helps reduce cost at the assembly level with increased leadframe capacity. Additional benefits of the LFGA are design options such as isolated power and ground rings and shorter wire lengths compared to standard QFN style packages.
