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QFN

The small size of these packages, coupled with excellent thermal and electrical performance, make the VFQFP-N and WFQFP-N ideal for hand held and portable communications applications including cellular phones, personal digital assistants (PDAs) and other applications where small, high performance packages are required. This package is also available in u,v,w,xt thickness versions, as well as 2-row configurations.

Package Configuration

QFN

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Lead Count	Body Size (mm)	Lead Count	Body Size (mm)	Lead Count	Body Size (mm)
6,8	1.5x1.5	3,4,6	1.2x1.5	8	3.3x3.0
3,6	1.6x1.6	4,6	1.2x1.6	17	3.3x1.35
4,6,8,10,12,14	2x2	8	1.35x1.70	16	3.5
4,6,8	2.05x2.05	12	1.35x2.50	14	3.5x3.0
10	2.2x2.2	12	1.35x3.0	24	3.5x4.5
8,10,12,14,16	2.5x.2.5	6	1.4x1.6	12	3.6x2.85
4,6,8,10,12,14,16,20	3x3	6	1.5x2.0	12,20,22,24,28,32	4x5
6,8	3.3x3.3	4	1.6x1.2	20	4.0x5.5
20	3.5x3.5	8	1.6x2.0	32	4x6
2,8,10,12,16,20,22,24,28,36	4x4	6,12	1.6x3.0	26,36	4x7
14,16,18,20,24,26,28,32,36,40	5x5	16	1.6x4.0	6	5x3.2
14,16,18,20,24,26,28,32,36,40	5x5	6	1.8x2.0	18,32,36,42	5x6
10,20,24,28,32,36,40,48	6x6	6	2.0x1.3	38	5x7
10,20,24,28,32,36,40,48	6x6	8	2x3	28	6x4
28,32,36,40,44,48,56	7x7	6	2x4	8	6x5
28,32,36,40,44,48,56	7x7	6	2x5	37	6x7
28,32,36,40,44,48,52,56,64,68	8x8	13	2.5x1.35	20,44	6x8
28,32,36,40,44,48,52,56,64,68	8x8	10	2.5x2.4	44	7.5x10
36,44,48,56,60,64,72,76	9x9	17	2.5x2.8	58	10x12
36,44,48,56,60,64,72,76	9x9	12	3x1
64,68,72,88	10x10	8	3x2
64,68,72,88	10x10	14	3.0x3.5
80,88,100,108	12x12	14,16,20,24	3x4

Available Options: Stacked die, System in Package, Flip Chip, Chip on Lead, Multi Die