Stacked Die QFN

This QFN/DFN package is also available as an MCM or SIP (System-In-Package) versions which brings enhanced functionality, package performance and integration perfectly suited for wireless and other applications needing system integration in a single package format.
 
Package Configuration

Leadless Packages

Stacked Die QFN
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Lead Count Body Size (mm) Lead Count Body Size (mm) Lead Count Body Size (mm)
6,8 1.5x1.5 3,4,6 1.2x1.5 8 3.3x3.0
3,6 1.6x1.6 4,6 1.2x1.6 17 3.3x1.35
4,6,8,10,12,14 2x2 8 1.35x1.70 16 3.5
4,6,8 2.05x2.05 12 1.35x2.50 14 3.5x3.0
10 2.2x2.2 12 1.35x3.0 24 3.5x4.5
8,10,12,14,16 2.5x.2.5 6 1.4x1.6 12 3.6x2.85
4,6,8,10,12,14,16,20 3x3 6 1.5x2.0 12,20,22,24,28,32 4x5
6,8 3.3x3.3 4 1.6x1.2 20 4.0x5.5
20 3.5x3.5 8 1.6x2.0 32 4x6
2,8,10,12,16,20,22,24,28,36 4x4 6,12 1.6x3.0 26,36 4x7
14,16,18,20,24,26,28,32,36,40 5x5 16 1.6x4.0 6 5x3.2
6 1.8x2.0 18,32,36,42 5x6
10,20,24,28,32,36,40,48 6x6 6 2.0x1.3 38 5x7
8 2x3 28 6x4
28,32,36,40,44,48,56 7x7 6 2x4 8 6x5
6 2x5 37 6x7
28,32,36,40,44,48,52,56,64,68 8x8 13 2.5x1.35 20,44 6x8
10 2.5x2.4 44 7.5x10
36,44,48,56,60,64,72,76 9x9 17 2.5x2.8 58 10x12
12 3x1  
64,68,72,88 10x10 8 3x2
14 3.0x3.5
80,88,100,108 12x12 14,16,20,24 3x4
Available Options: Stacked die, System in Package, Flip Chip, Chip on Lead, Multi Die