Wafer Level Packaging

Unisem offers a Wafer Level CSP low cost solution that enables direct connectivity at the substrate or board level. To help provide this service we are equipped with latest state-of-the art Laser Mark , Rudolph Wafer 2D/3D inspection station and high speed Muhlbauer Die Sorter. We offered a full turnkey solution for Wafer Level CSP from WAFER BUMPING, PACKAGING , TEST SOLUTION (probing) and full wafer map integration to handle die size from 0.5 mm2 to 7 mm2.