Wafer Bumping

Unisem-Advanpack Technologies Sdn Bhd ("UAT"), a joint venture between Unisem (M) Berhad and Advanpack Solutions Pte Ltd., located in Ipoh, Malaysia, is one of the first independent wafer bumping service providers in Malaysia.

UAT commenced its operations in 2006. The total built-up area of the wafer bump facility is about 22,000 square feet with a minimum class 1,000 cleanroom.

UAT offers a one-stop wafer bumping services which include, gold bumps, electroplated solder bumps, electroplated pillar bumps and larger solder bumps through "ball drop" process. UAT also offers pad redistribution and repassivation for wafer sizes of 100mm, 150mm and 200mm diameter.

The Company is also certified with the ISO 9001:2000 Quality and ISO 14001:2004.