Unisem Advanced Technologies Sdn Bhd (UAT) (Formerly known as Unisem-Advanpack Technologies Sdn Bhd), is one of the first independent wafer bumping service providers in Malaysia.
UAT offers Gold Bumping, Electroplated Solder Bumping, Electroplated Copper Pillar Bumping and Large Solder Bumping (ball drop). Other services include PBO, Polyimides and BCB passivation, redistribution of bond pads and in-house photomask & stencil design.
UAT commenced operations in 2006. This 22,000 square feet with class 1K cleanroom supports wafer sizes of 100mm, 150mm and 200mm diameter.
UAT is certified to IATF 16949:2016, ISO 9001:2015, ISO 14001:2015, ANSI/ESD S20.20-2014, RBA VAP, Samsung ECO Partner and is a certified Sony Green Partner.