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MIS Technology

MIS Technology

Molded Interconnect System (MIS) – Pre-molded, routable, fine pitch leadframe solution for complex designs that require a smaller package footprint and thinner package height.

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Assembly

Assembly

Unisem provides complete turnkey assembly services of leadless, laminate, leadframe and wafer level packages through its three full turnkey factory locations in Malayasia, China and Indonesia.

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Test

Test

Unisem provides a full range of package testing services include analog, digital and mixed signal testing with over 100 test systems and more than 150,000 total square feet dedicated to testing.

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Wafer Bumping

Wafer Bumping

Unisem offers wafer bumping services through its subsidiary Unisem Advanced Technologies (UAT) in Ipoh, Malaysia and at their factory in Chengdu, China. Unisem offers over 100 variations of gold, copper pillar and solder bumping options.

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Chengdu

Chengdu

Unisem Chengdu (China) offers wafer bumping as well as full turnkey semiconductor assembly and test services including wafer probe, wafer backgrinding, assembly, test, and drop-shipping of finished goods.

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Latest News
22 Mar 2022
Unisem Gopeng Project groundbreaking

17 Jan 2019
News release VGO completion

12 Sep 2018
News release Pre-Conditional VGO

Financial Releases
2022 Q4

Quarterly report on consolidated results for the third financial quarter ended 31/12/2022

4Q 2022 Analyst Briefing Presentation

Ipoh

Ipoh

Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in Malaysia. Unisem...

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Chengdu

Chengdu

Unisem Chengdu Co., Ltd. (“Unisem Chengdu”), the Group’s latest state-of-the-art Semiconductor Assembly and Test facility...

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UAT

UAT

Unisem Advanced Technologies Sdn Bhd (UAT) (Formerly known as Unisem-Advanpack Technologies Sdn Bhd), is one...

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