Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in Malaysia. Unisem Ipoh offers an integrated suite of packaging and test services for semiconductor companies such as wafer bump, wafer probe, wafer backgrinding, a wide range of leadframe and substrate IC packaging, high-end radio frequency and mix-signal test, tape & reel and drop-shipment services.

Unisem Ipoh is certified with various Quality Management Systems, Environmental Management Systems, Occupational Health and Safety Management System, Social Responsible and Green Partners, such as IATF 16949:2016, ISO 9001:2015, ISO 14001:2015, ISO 45001:2018, ANSI/ESD S20.20-2014, RBA VAP,  Samsung ECO Partner and is a certified Sony Green Partner.

Ipoh Fact Sheet

Unisem’s assembly and test services facility in Ipoh, Malaysia provides a full range of probe, test, engineering and other test related services. With 63,000 square foot of factory floor space dedicated to test services, Unisem’s Ipoh factory can meet your company’s test services needs to provide a full turnkey solution.

Unisem provides solutions for our customers’ test strategy enabling them to concentrate on their products rather than troubleshooting test hardware, software and other test issues. Our Test Engineering Support, Product Failure Analysis, and our Test Development Group are committed to providing test solutions beyond our customer’s expectations.

Tester Platforms
Handler List
Wafer Probe
Post Test