Unisem Group

Menu

  • Package Offerings
  • Operations
  • Quality
  • Company Info
  • News
  • Investor Relations

QSOP

QSOP

QSOP is a package with a compressed body size and a finer lead pitch in order to obtain smaller versions of the standard SOIC package.

Package Configurations (PDF)

  • Laminate Packages
    • FBGA / LGA
    • MCM / SIP
    • Stacked Die BGA
  • Leadframe Packages
    • PDIP
    • QSOP
    • SOIC
    • SSOP
    • TSOT
    • TSSOP
  • Leadless Packages
    • SLP
    • SLP SIP
    • Stacked Die SLP
    • MIS Package
  • MEMs Packaging
    • LGA-FLP Package Outline
    • LGA-MCP Package Outline
    • LGA-MLP Package Outline
  • Wafer Level Packaging
  • 2023 Package Portfolio/Calendar

Ipoh

Ipoh

Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in Malaysia. Unisem...

More info

Chengdu

Chengdu

Unisem Chengdu Co., Ltd. (“Unisem Chengdu”), the Group’s latest state-of-the-art Semiconductor Assembly and Test facility...

More info

UAT

UAT

Unisem Advanced Technologies Sdn Bhd (UAT) (Formerly known as Unisem-Advanpack Technologies Sdn Bhd), is one...

More info

Search

© 2016 Unisem (M) Berhad (183314-V). All rights reserved.
  • Package Offerings
  • Operations
  • Quality
  • Company Info
  • News
  • Investor Relations
  • Contact Info