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TSOT

SOT

The TSOT package is a thinner version of the SOT23 package family with a package thickness of 0.87mm.

Package Configurations (PDF)

  • Laminate Packages
    • FBGA / LGA
    • MCM / SIP
    • Stacked Die BGA
  • Leadframe Packages
    • PDIP
    • QSOP
    • SOIC
    • SSOP
    • TSOT
    • TSSOP
  • Leadless Packages
    • SLP
    • SLP SIP
    • Stacked Die SLP
    • MIS Package
  • MEMs Packaging
    • LGA-FLP Package Outline
    • LGA-MCP Package Outline
    • LGA-MLP Package Outline
  • Wafer Level Packaging
  • 2023 Package Portfolio/Calendar

Ipoh

Ipoh

Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in Malaysia. Unisem...

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Chengdu

Chengdu

Unisem Chengdu Co., Ltd. (“Unisem Chengdu”), the Group’s latest state-of-the-art Semiconductor Assembly and Test facility...

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UAT

UAT

Unisem Advanced Technologies Sdn Bhd (UAT) (Formerly known as Unisem-Advanpack Technologies Sdn Bhd), is one...

More info

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