MEMS

Unisem has developed packaging solutions for many MEMs applications including microphones for the mobile market, pressure sensors for automotive and accelerometers for consumer and other markets. Unisem has the experience in both the design and manufacturing of the specialized packaging required for each unique MEMs design. High volume MEMs packaging is available at both Unisem’s factory in Chengdu, China and in Batam Indonesia.

MEMS Datasheet