Unisem Group

Menu

  • Package Offerings
  • Operations
  • Quality
  • Company Info
  • News
  • Investor Relations

SSOP

SSOP

Our Shrink Small Outline Package (SSOP) is designed for portable products that require reduced size and weight. The SSOP is typically found in pagers, disk drives, portable audio and video products and wireless telecommunications products. It is available in 16 to 56 lead counts.

Package Configurations (PDF)

Financial Releases
  • Mission
  • Board of Directors
  • Management Team
  • Corporate Governance
  • Corporate Social Responsibility
  • History
  • Career Opportunities
  • Contact Info
  • Chengdu
  • Ipoh
  • UAT
  • Laminate Packages
    • FBGA / LGA
    • MCM / SIP
    • Stacked Die BGA
  • Leadframe Packages
    • PDIP
    • QSOP
    • SOIC
    • SSOP
    • TSOT
    • TSSOP
  • Leadless Packages
    • SLP
    • SLP SIP
    • Stacked Die SLP
    • MIS Package
  • MEMs Packaging
    • LGA-FLP Package Outline
    • LGA-MCP Package Outline
    • LGA-MLP Package Outline
  • Wafer Level Packaging
  • 2025 Package Portfolio/Calendar
  • Quality Policy
  • Quality Assurance
  • Quality Management System
  • Reliability Monitoring
  • Batam test info
  • Chengdu test info
  • Ipoh test info
  • Announcements
  • Financial Releases
  • Quarterly Reports
  • Annual Reports
  • AGM
  • EGM
  • Share Info
  • IR Contact

Ipoh

Ipoh

Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in Malaysia. Unisem...

More info

Chengdu

Chengdu

Unisem Chengdu Co., Ltd. (“Unisem Chengdu”), the Group’s latest state-of-the-art Semiconductor Assembly and Test facility...

More info

UAT

UAT

Unisem Advanced Technologies Sdn Bhd (UAT) (Formerly known as Unisem-Advanpack Technologies Sdn Bhd), is one...

More info

Search

© 2016 Unisem (M) Berhad (183314-V). All rights reserved.
  • Package Offerings
  • Operations
  • Quality
  • Company Info
  • News
  • Investor Relations
  • Contact Info