November 2014
Unisem/UAT: EICC Validated Audit Process certified by DNV GL certification body.
June 2014
Achieved Samsung ECO Green Partner Certification
April 2014
ANSI ESD S20.20 certification by NQA
January 2013
WLCSP production begins in Chengdu
December 2011
Wafer Bumping goes into full production in Chengdu
April 2011
Flip Chip LGA goes into mass production in Chengdu
January 2011
Chengdu introduces SIP Module Capabilities
August 2010
MEMs go into production in Chengdu
Unisem Advanced Technologies Sdn Bhd (“UAT”) (formerly known as Unisem-Advanpack Technologies Sdn Bhd) entered into a license agreement with FlipChip International, LLC (“FCI”). FCI became a shareholder of UAT.
July 2007
Acquired Advanced Interconnect Technologies Limited (now known as Unisem (Mauritius) Holdings Limited).
January 2007
Unisem (M) Berhad certified with ISO/TS 16949:2002.
October 2006
Unisem Chengdu opens its phase one factory in Chengdu, Sichuan, PRC.
June 2006
Established wafer-level CSP test capability.
April 2006
Re-certification of MS ISO 14001 on environmental management systems.
March 2006
Commenced wafer bump services.
November 2005
Change of Corporate Logo.
July 2005
Completed construction of the wafer bumping factory building and installation of cleanroom.
May 2005
Expanded radio frequency test capability from single function building block to highly integrated radio frequency device. Using ASL3KRF as next generation test platform.
Incorporated Unisem Chengdu Co., Ltd., a semiconductor packaging and test facility in Chengdu, Sichuan, PRC.
November 2004
Commenced construction of the wafer bumping factory building.
September 2004
Incorporation of a joint-venture company, Unisem Technologies Sdn Bhd (now known as Unisem-Advanpack Technologies Sdn Bhd) for packaging and bumping of semiconductor devices.
June 2004
Acquired Atlantic Technology Holdings (UK) Limited (now known as Unisem (Europe) Holdings Limited).
June 2004
Re-certification of QS 9000 on quality systems certification for quality assurance in production, installation and servicing.
May 2004
Expanded mixed signal capability by adding Teradyne Catalyst.
March 2004
Awarded ISO 9001:2000 quality systems certification for quality assurance in production, installation and servicing.
January 2004
Established high end mixed signal test capability by installing Teradyne Integra-FLEX, with Octal-site testing.
June 2003
Certificate of Green Partner from Sony, an environmental management system that has met the requirements of the Sony Green Partner Program.
January 2003
Re-certification of MS ISO 14001 on environmental management systems.
June 2002
Attained the International Procurement Centre License for performing drop shipments.
January 2002
Launched the small leadless packages (SLP).
June 2001
Commenced wafer probe services.
March 2001
Awarded QS 9000 and ISO 9002 quality system certification for quality assurance in production, installation and servicing.
September 2000
Completed construction of the Phase III factory building with an additional built-up area of about 330,000 square feet.
May 2000
Attained the MS ISO 14001 certification on environmental management systems.
Commenced construction of the Phase III factory building.
July 1998
Listed on the Kuala Lumpur Stock Exchange (now known as Bursa Malaysia Securities Berhad) Main Board.
June 1997
Converted into a public limited company.
February 1997
Computerized the final visual inspection operations with an automated inspection system.
August 1996
Completed construction of the Phase II factory building with an additional built-up area of 110,000 square feet.
May 1996
Launched the fine-pitch / miniaturized SSOP.
May 1996
Upgraded and expanded the molding capability with an automated molding system.
March 1996
Commenced drop-ship services.
September 1995
Expanded the final test area to 20,000 square feet.
January 1994
Set up the tape and reel packing operations.
July 1993
Set up the final test operations with an initial 3,000 square feet.
June 1993
Launched the fine-pitch packaging operations and commenced production of the QSOP packages.
March 1993
Awarded MS ISO 9002 quality systems certification for quality assurance in production, installation and servicing.
July 1992
Commenced mass production of semiconductor packages with about 300 employees.
March 1992
Completed construction of the Phase I factory building with a built-up area of about 130,000 square feet.
September 1991
Commenced construction of the Phase I factory building.
June 1989
Incorporated as a private limited company under the Malaysian Companies Act, 1965.