LGA-FLP: LGA Formed Lid Package – Laminate substrate based package with a stamped metal lid.
Stamped Lid:
• SUS304 Stainless steel
• C7521-R Cu alloy solderable finish
• With/without pressure port
Package Options:
• Multi die
• Stacked die
• Wire bond / Flip chip
• SMT / Si passives
• Embedded passive substrates
• Top / Bottom Port
• Glob top