LGA-MCP: LGA Molded Cavity Package. Laminate substrate based molded cavity package with a flat metal, plastic, glass lid.


Custom Mold:
Using BGA mold system with tool cavity vacuum to create a custom package where die can be molded or placed in a cavity created by the mold.
• Automotive applications.

Package Options:
• Molded die + cavity
• Multi die
• Stacked die
• Wire bond / Flip chip
• SMT passives
• Top/Bottom Port
• Glop top + full die coat
• Various lid materials