Our Fine-pitch Ball Grid Array (FBGA) is a chip-scale package designed especially for markets requiring miniaturization, such as hand-held consumer products, cellular phones and laptop computers. The FBGA features a standard BT substrate and fine solder ball pitch, available in 0.5mm and 0.8mm sizes. It also offers the fastest assembly throughput of our fine-pitch packages. This package is also available in an LGA (land grid array) version for an ultra thin profile.

Package Configurations (PDF)