Unisem’s Stacked Die BGA can be used to stack 2 or more die in a pyramid style or same die stack resulting in fewer packages and a smaller footprint. This near chip-scale option is assembled using standard FBGA tooling and is also available in LGA format. Wafer thinning, overhang wire bond technology and spacers are used between stacked die. Die to die bonding also can also enhance the thermal and electrical performance.