Our Low Profile Quad Flat Package (LQFP) is a lightweight package often found in cordless and radio frequency devices. The LQFP is ideal for application-specific integrated circuits, digital signal processors, microprocessors/controllers, graphic processors, gate arrays, static random access memory and PC chipsets. It is available in 32 to 144 lead counts, in 1.4mm package thickness.

Package Configurations (PDF)